| Overview of the process elements of production and testing possibilities by location:
| Process | Switzerland | Sri Lanka | China | | Hand mounting | x | x | x | | Hand soldering | x | x | x | | Wave soldering | x | x | x | 3D Solder Paste Inspection System
| - | x
| - | | SMD mounting top | x | x | x | | SMD mounting bottom | x | x | x | | SMD glueing | x | x | x | | Stencil Printing | x | x | x | | Reflow soldering | x | x | x | | Selective soldering | x | - | - | Sealing
| - | x | x | | Coating | - | x | x
| | Repair SMT/THT | x | x | x | | Insertion technology | - | x | - | | End assembling | x | x | x | ICT in circuit test | x | x | x | | Flying Probe | x | - | - | | AOI - Automatic optical inspection | x | x | x
| | Function test | x | x | x |
|
- By request traceability via IBS
- 100% in Line AOI
- FPY 2009: >97%
|