Test systems of the CCS Group

Advantages and disadvantages of the different test systems:

The procedure	Advantage	Disadvantage	Site in the CCS-Group
3D Solder Paste Inspection System	80% of the production errors are caused by unclean paste printing. This system detects any such defects.		Sri Lanka
AOI	Initial inspection on the production line for detection of: not loaded components correct polarisation incorrect position short circuit of component contact	no electrical test	Switzerland
In-Circuit-Test ICT	short duration and thus low cost test higher assembly units throughput	relatively expensive adapter change of adapter very costly	Sri Lanka Switzerland
Flying Prober FP	no costly needle adaptor necessary short initial time ideal for prototype and small series	depending on complexity possibly longer and more expensive test time Contact problems with inappropriate circuit board design	Switzerland
Function Test F-Test	for blockwise tests less needle contact necessary than with ICT FPGA, Processors, RAM, Flash-Eprom can be tested analysis from analog signals possible	initial cost	Sri Lanka Switzerland
«Standalone» PC-Function test	as above deployed in various sites	initial costs necessary measuring hardware & PC system	China Sri Lanka Switzerland

If ever enormously high testing demands are required, our sites in Switzerland and Sri Lanka are equipped with several identical function test systems. These systems are built modularly and base on National Instruments Hard- and Labview- Software.

13.5.2011 (oe)